Modeling and Simulation for Manufacturing and Semiconductor Packaging

Course Description

In today's rapidly evolving manufacturing landscape, modeling and simulation (M&S) is a vital tool for designing, analyzing, and optimizing processes across materials manufacturing and semiconductor packaging. This course provides practical, hands-on experience in applying the Finite Element Method (FEM) to simulate and interpret the thermo-mechanical load experienced by the material during both production and operational service. Students will gain a thorough understanding of FEM fundamentals and follow a step-by-step approach to conducting simulations using industry-standard FEM software. Through detailed analysis of simulation outcomes, students will assess material deformation under challenging load conditions, calculate heat flux and heat transfer between components in semiconductor packages, and develop strategies to improve performance. By the end of this course, participants will confidently apply FEM techniques to address real-world engineering problems, interpret simulation data to optimize designs, and incorporate experimental findings into their modeling processes.

Code

MSE 508

Credits

3

Subject

Materials Science & Engr