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MDI 505

Computational Materials Chemistry and Physics

University at Buffalo 3 credits Materials Design & Innovation

Course Description

This course will provide a unified perspective of inorganic/macromolecular and hybrid bonded materials with a focus on quantifying structure-property relationships. This course provides an overview of the role of chemical bonding and electronic structure on defining properties from an electronic structure perspective.

Code
MDI 505
Credits
3
Subject
Materials Design & Innovation

Programs That Include This Course

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