The University of Texas at Austin 3 credits Mechanical Engineering
Explore basics of semiconductor fabrication, microelectronics packaging techniques, thermomechanical issues in packaging, reliability-related aspects in packaging, thermal management conditions, Conduction-based cooling, air and liquid cooling, phase change-based cooling, role of packaging materials. Discuss challenges and solutions at multiple length scales, from transistors (nanometers) to data centers (10's of meters). Mechanical Engineering 397 (Topic: Microelectronics Pckg: Fndmtls) and Mechanical Engineering 381R (Topic 8) may not both be counted. Three lecture hours a week for one semester. Pre/Corequisites: Graduate standing, undergraduate coursework in heat transfer or the equivalent, and consent of instructor.
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