University at Buffalo 3 credits Electrical Engineering
Fabrication technology for microelectronic devices: crystal growth, wafer fabrication and characterization, mask fabrication, epitaxy, lithography, etching, diffusion, CVD, ion implantation, dc and RF plasma reactors (operating principles and fabrication applications), packing. Operation of microelectronic devices (interconnects, passive devices, and MOS and BJT devices), micro-optical devices (CDRs, etc.) and micro electro-mechanical devices (micro-motors, micro-mirror arrays, etc). Students select a part of the fabrication process (lithography, diffusion, etc.) and use simulation code to design that step of the process to achieve specific device properties. Pre-Requisite: EE 311; Engineering Majors or Electrical Engineering Minors Only.
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