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ECE 4755

Electronic Packaging Substrate Fabrication

Georgia Institute of Technology 3 credits Electrical & Computer Engr

Course Description

This course provides hands-on instruction in basic packaging substrate fabrication techniques, including interconnect design and testing, dielectric deposition, via formation, and metallization. Crosslisted with CHE 4755.

Code
ECE 4755
Credits
3
Subject
Electrical & Computer Engr

Programs That Include This Course

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